Standard Fanless Industrial PCs:

As the cornerstone of our product portfolio, the EPC series offers four rugged form factors. At its core is full coverage across six processor platforms combined with exceptional modular expandability:

• Intel Platforms: Flexible configurations with Celeron J1900 / J6412, and 7th / 10th / 12th Gen Intel® Core™ processors (up to i7), meeting demands from low-power applications to high-performance edge computing.
• Domestic Platforms:
  Fully compatible with domestic processors such as Phytium and Rockchip, supporting the development of China’s information technology innovation (Xinchuang) industry.

LEGO MODE IPC（ODM）

Built on a robust standard industrial PC platform, CESIPC’s customized models leverage the innovative “LEGO MODE” modular technology to enable agile interface definition. At the core are the i-Door functional interface and CESIPC expansion slot design, supporting the rapid integration of customer-specific functional modules — such as CAN bus, 5-channel LAN, and 5G communication.

This modular architecture significantly shortens assembly and delivery cycles, enabling efficient and responsive customization. More importantly, it avoids the high development costs typically associated with small-batch customization, saving customers substantial time and development expenses. It is a flexible, cost-effective, and intelligent industrial solution.