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Industrial Computing Solutions in Food Processing and Packaging
CESIPC present its CleanOps™ industrial computing platform at the 2025 Shenzhen Food & Processing Packaging Exhibition (ProPak Shenzhen 2025), one of the leading trade fairs in South China for food processing, packaging, and automation technologies. The exhibition brings together equipment manufacturers, system integrators, and end users from across the food, beverage, dairy, and ready-to-eat food industries.
At this year’s event, CESIPC focuses on industrial computing solutions designed for hygienic, washdown-intensive production environments, addressing the increasing demand for reliability, cleanability, and long-term operational stability in modern food processing facilities.
Industrial Challenges in Food Processing and Packaging
Food and packaging production environments impose unique requirements on industrial control hardware:
- Frequent high-pressure washdown and chemical cleaning
- High humidity, temperature variations, and corrosion risks
- Continuous 24/7 operation with minimal downtime tolerance
- Increasing integration of automation, vision systems, and data acquisition
Traditional industrial PCs often struggle to maintain long service life under these conditions. CleanOps™ was developed to directly address these challenges through robust mechanical design, industrial-grade electronics, and scalable system architecture.
CleanOps™ Platform Overview
The CleanOps™ industrial computing platform is designed as a modular solution family, enabling deployment across different functional levels of food processing and packaging lines — from local operator interfaces to high-performance edge computing nodes.
Key design principles include:
- Hygienic and easy-to-clean enclosure concepts
- Industrial-grade reliability for continuous operation
- Open system architecture for seamless integration
- Scalable performance from entry-level to advanced applications
Suitable Areas: Main production lines in washdown zones
Protection: Full 304 stainless steel construction, IP67 & IP69K
Applications: Core workstations in food & pharma washdown areas
Key Advantages: Withstands 80 °C / 80–100 bar high-pressure hot-water washdowns; compatible with foam cleaning, high-pressure spray, and disinfection; reliable 360° exposed installation without needing a cabinet.
Suitable Areas: Clean zones / hygienic work areas
Protection: Embedded 304 stainless steel front bezel, IP69K
Applications: Food & pharma cleanroom equipment panels
Key Advantages: Top-tier hygienic front-panel design; ideal for cleanrooms when cabinet-mounted, meeting non-contact area industry standards.
Suitable Areas: Office / QC / light-humidity
Protection: Aluminum front bezel, IP54–IP65; moisture-sealed I/O
Applications: Food & pharma QC, monitoring, sampling
Key Advantages: Moisture-resistant, anti-corrosion, supports frequent alcohol wiping; best value for office & light-humidity use.
Suitable Areas: Light-humidity zones / epoxy environments
Protection: Epoxy front bezel, IP65
Typical Applications: Food & pharmaceutical packaging and sorting workstations
Key Advantages: Entry-level hygienic protection with the best cost-performance ratio; ideal for cabinet-integrated installations
Industrial Integration and System Compatibility
CleanOps™ platforms are designed as open industrial systems, supporting:
- Multiple operating systems, including Windows and Linux
- Standard industrial fieldbus and Ethernet-based protocols
- Easy integration into existing automation and IT infrastructures
This openness allows system integrators and equipment manufacturers to implement CleanOps™ without modifying established control architectures.
Applications in Food Processing and Packaging
Typical use cases demonstrated at the exhibition include:
- Operator control and visualization in washdown areas
- Process monitoring and parameter control
- Vision-based inspection and verification systems
- Edge data acquisition and production analytics
By combining robust hardware with flexible system design, CleanOps™ supports both current automation needs and future digitalization strategies.
CESIPC at ProPak Shenzhen 2025
During the exhibition, CESIPC’s technical team will provide detailed consultations on system selection, environmental requirements, and application-specific configurations. Visitors can explore how CleanOps™ platforms are engineered to meet the strict operational and hygienic demands of food processing and packaging environments.
As food manufacturers continue to invest in automation, digitalization, and operational reliability, the role of industrial computing platforms becomes increasingly critical. CESIPC remains committed to delivering engineering-driven, application-focused industrial computing solutions that support long-term system stability and scalable production architectures.
CleanOps™ represents CESIPC’s approach to industrial computing — reliable, adaptable, and designed for real production environments.
Industrial Panel PCs – When Appearance Matters Too
In the food and packaging industry, selecting the right industrial panel PC involves more than just screen size, performance, or functional features — design and enclosure construction are equally critical. Key considerations include the required ingress protection level of the complete system: IP65, IP67, or even IP69K. In many cases, a device may offer an IP65-rated front panel while its connectors or rear housing meet different protection levels. At CESIPC, all panel PCs start at a minimum of IP65 protection.
In hygiene-sensitive industries such as food & beverage and chemical processing, aggressive cleaning agents and disinfectants can gradually attack standard aluminum front panels. To address this, CESIPC offers not only stainless steel housings but also advanced anti-corrosion surface treatments for aluminum front panels. In real-world industrial environments, details often determine success or failure. Our engineering team understands these potential pitfalls and knows exactly what to look for. They are committed to helping you select the right panel PC — and, when necessary, will conduct on-site evaluations to ensure the solution truly fits the application.
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