After a two-year hiatus, CESIPC made a strong return to the Malaysia Industrial Automation Exhibition in May 2025, unveiling a brand-new generation of industrial PC designs. Our latest innovation—the LEGO-style modular concept—quickly became a highlight of the event and earned widespread praise from industry professionals.
Redefining Flexibility with LEGO-Style Design
The LEGO-style design is a modular, user-centric architecture that allows for fast and flexible configuration based on application requirements. From CPU performance to I/O expansion, power input, and additional modules, every component can be customized like building blocks—making it easier than ever to scale, upgrade, or maintain.
This design addresses a growing demand for customized and quick-deploy industrial computing solutions, especially in scenarios involving equipment control, edge computing, smart manufacturing, and intelligent transportation systems.
High Performance Meets Industrial Durability
CESIPC showcased a full lineup of modular IPC platforms at the event, including models powered by Intel® 12th Gen, 10th Gen, J6412, and J1900 processors. These platforms combine high performance, industrial-grade stability, and long product life cycles—making them suitable for a wide range of automation and control applications.
Strong Local Engagement
Throughout the exhibition, CESIPC engaged with local system integrators, automation solution providers, and end users. Many expressed strong interest in the modular design approach and initiated discussions for future collaboration. This event further solidified CESIPC’s presence and commitment to the Southeast Asian market.
Looking Ahead
At CESIPC, we believe that innovation and practicality must go hand in hand. The enthusiastic response to our new LEGO-style design reaffirms our direction and motivates us to keep pushing the boundaries of industrial computing.
We are excited about what lies ahead—and we’ll continue to bring smarter, more adaptable, and more powerful solutions to industrial customers around the world.
Stay connected. The next chapter of CESIPC innovation is just getting started.
Until next year – thank you for being part of our journey
